Chip
ChipSense™ — the hyperspectral sensor
Unlock the power of compact, low-cost, contactless, and non-destructive (bio)material analysis into your products.
500–1700 nm · 64 bands · 16 channels · 4×4 mm package
- Rich Spectral Fingerprint
- InGaAs active layer delivers high photosensitivity across the 500–1700 nm spectral range, outperforming silicon and alternative NIR/SWIR solutions limited to narrower wavelength ranges.
- Accurate and Fast
- ChipSense™ Computational Spectroscopy architecture captures 64 broad overlapping spectral bands in a single shot through just 16 photodetectors thereby generating feature-rich datasets enabling, for broad features, (AI/ML-based) prediction accuracies comparable to high resolution lab-based spectrometers
- Reliable and repeatable
- Monolithic integration of photodetectors and filters delivers exceptional sensor uniformity. No per-device calibration while ensuring consistent, repeatable measurements.
- Compact and scalable
- The 1.55 x1.55 mm die footprint, combined with standard III-V fabrication and packaging processes, enables high reproducibility, cost efficiency, and scalability for high-volume applications.
- Versatile and re-usable
- Broad spectral response enables flexible system optimization through light-source selection, optical front-end design, and acquisition modes (e.g. single-shot or time-division multiplexing). Application-specific algorithms and data interpretation are implemented in software, maximizing sensor reuse across different applications.
